Experience : 1- 3 Years
Collaborate and work in a team environment with Design, Applications, Test, Marketing, Manufacturing, Quality and Reliability in all aspects of new product development, production release to accomplish goals and objectives
Work with process and package technology development to develop and qualify technologies for new product development
Work closely with the global manufacturing facilities to address customer specific product quality, yield management and cost reductions issues on mature products. Scope of work could include product spins and derivatives
Develop and implement Qualification plans
Design sHTOL, dHTOL, ELFR, BHAST, and PTC boards to qualify Analog products.
Perform evaluation, debug and characterization of integrated circuits to ensure they meet the product requirement specifications and manufacturing requirements
Work with failure analysis (FA) to determine root cause of any reliability and qualification failures
Work with planning team to ensure smooth device ramp post release to manufacturing (RTM).
Qualify second source wafer fab, assembly / test (A/T) facility, and Bill of Materials (BOM) to ensure device continuity of supply.
Perform test conversion, test time reduction, and yield improvements to achieve device entitlement operational transfer cost (OTC).
Work with wafer fabrication, assembly & test sites to guarantee schedule, cost and quality
Communicate weekly to management on status of each project